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    Part Img OPA602AU/2K5 datasheet by Texas Instruments

    • High-Speed Precision Difet(R) Operational Amplifier 8-SOIC -25 to 85
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.33.00.01
    • 8542.33.00.00
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    OPA602AU/2K5 datasheet preview

    OPA602AU/2K5 Frequently Asked Questions (FAQs)

    • A good PCB layout for OPA602AU/2K5 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. Additionally, it's recommended to use a low-ESR capacitor for the compensation capacitor (Ccomp) to ensure stability.
    • The recommended Ccomp value depends on the gain and bandwidth of the amplifier. A general rule of thumb is to use a Ccomp value between 10pF to 100pF. For a specific application, consult the OPA602AU/2K5 datasheet and application notes, or use TI's online calculator tools to determine the optimal Ccomp value.
    • The maximum power dissipation of OPA602AU/2K5 is 1.4W. To ensure it doesn't overheat, make sure to provide adequate heat sinking, such as a copper plane or a heat sink, and keep the ambient temperature below 85°C. Also, ensure that the output current is within the recommended range to avoid excessive power dissipation.
    • Yes, OPA602AU/2K5 can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is high enough to avoid loading the input signal. Additionally, the output impedance should be low enough to drive the load. In this configuration, the compensation capacitor (Ccomp) may not be required, but it's still recommended to use a small value (e.g., 10pF) to ensure stability.
    • To protect OPA602AU/2K5 from EMI and RFI, use shielding, such as a metal enclosure or a shielded cable, to prevent electromagnetic radiation from coupling into the circuit. Additionally, use a common-mode choke or a ferrite bead on the input and output lines to filter out high-frequency noise. Ensure that the PCB layout is designed to minimize radiation and coupling between traces.
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