A good PCB layout for OPA355NA/3KG4 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. TI provides a recommended layout in the datasheet and application notes.
The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements. TI provides a gain resistor calculator tool and application notes to help with the selection. Generally, it's recommended to use 1% or 0.1% tolerance resistors to ensure accuracy and stability.
The maximum power dissipation of OPA355NA/3KG4 is dependent on the ambient temperature and package type. For the DSBGA package, the maximum power dissipation is 500mW at 25°C. However, it's recommended to derate the power dissipation based on the operating temperature and desired reliability.
OPA355NA/3KG4 is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to consult the datasheet and application notes for guidance on using the device in high-temperature environments.
To protect OPA355NA/3KG4 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use filtering and shielding on the input and output lines. Additionally, use a low-pass filter or a ferrite bead on the power supply lines to reduce high-frequency noise.
OPA355NA/3KG4 datasheet
by Texas Instruments
