OPA355NA/250 datasheet by Texas Instruments

OPA355NA/250 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of OPA355NA/250?
  A good PCB layout for OPA355NA/250 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
• How do I ensure stability when using OPA355NA/250 in a gain configuration?
  To ensure stability, ensure that the gain is set correctly, and the feedback network is properly compensated. A good rule of thumb is to keep the gain below 10 and use a feedback capacitor value between 10pF to 100pF.
• What is the maximum power dissipation of OPA355NA/250?
  The maximum power dissipation of OPA355NA/250 is 670mW. However, it's recommended to keep the power dissipation below 500mW to ensure reliable operation.
• Can I use OPA355NA/250 in a high-temperature environment?
  Yes, OPA355NA/250 is rated for operation up to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C.
• How do I protect OPA355NA/250 from ESD damage?
  To protect OPA355NA/250 from ESD damage, use ESD protection devices such as TVS diodes or ESD protection arrays on the input and output pins. Additionally, follow proper handling and storage procedures to prevent ESD damage.