Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, keeps the input and output traces short and separate, and uses a solid ground plane to reduce noise and electromagnetic interference (EMI). A 4-layer PCB with a dedicated ground plane is recommended.
To ensure stability, it's essential to follow the recommended compensation network and component values, and to maintain a minimum gain of 2V/V. Additionally, the output impedance of the source should be low enough to prevent oscillations, and the feedback network should be designed to provide sufficient phase margin.
The maximum power dissipation of OPA2691I-14DR is 1.4W. To calculate the power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
Yes, OPA2691I-14DR is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C. It's essential to ensure proper thermal management and heat sinking to prevent overheating.
To protect OPA2691I-14DR from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, use a low-pass filter or a shielded cable to reduce radiated emissions.
OPA2691I-14DR datasheet
by Texas Instruments
