A good PCB layout for OPA2691I-14D involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements. TI provides a gain resistor calculator tool and application notes to help with the selection. Additionally, the datasheet provides guidelines for selecting gain resistors.
The maximum power dissipation of OPA2691I-14D is dependent on the ambient temperature and the thermal resistance of the package. The datasheet provides a power dissipation calculation formula and a thermal resistance table to help determine the maximum power dissipation.
OPA2691I-14D is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. TI provides guidance on high-temperature operation in the datasheet and application notes.
To protect OPA2691I-14D from EMI, use shielding, filtering, and grounding techniques. Keep the device away from high-frequency sources, use a solid ground plane, and add bypass capacitors to the power supply lines. TI provides EMI protection guidelines in the datasheet and application notes.