Texas Instruments provides a recommended PCB layout in the OPA2364A datasheet, which includes guidelines for component placement, trace routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate analog ground plane to minimize noise and interference.
The OPA2364AIDGKRG4 requires a dual supply voltage (±VCC) and a common-mode voltage (VCM) to operate. Ensure that the supply voltage is within the recommended range (±2.5V to ±5.5V) and that the common-mode voltage is set to the desired level (typically VCC/2). Also, ensure that the input and output signals are within the recommended voltage ranges.
The OPA2364AIDGKRG4 can drive capacitive loads up to 100pF without oscillation or instability. However, it's recommended to use a series resistor (Rs) to limit the capacitive load and prevent oscillation. The value of Rs depends on the capacitive load and the desired frequency response.
To reduce noise and EMI, use proper PCB layout techniques, such as separating analog and digital signals, using ground planes, and minimizing trace lengths. Additionally, use shielding, filtering, and decoupling capacitors to reduce noise and EMI. TI also recommends using a low-noise power supply and minimizing the use of switching regulators.
The OPA2364AIDGKRG4 has a thermal derating of 13.9mW/°C above 25°C. This means that the maximum power dissipation decreases by 13.9mW for every degree Celsius above 25°C. Ensure that the device is properly heat-sinked and that the ambient temperature is within the recommended range.