A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
Use a shielded enclosure, keep sensitive analog traces away from digital traces, and use a common mode choke or ferrite bead on the power lines. Ensure a solid ground plane and decouple the power supply.
Power up the VCC pin first, followed by the VDD pin. Ensure a minimum of 10 ms delay between power-up and signal application.
The thermal shutdown feature is enabled by default. If the junction temperature exceeds 150°C, the device will shut down. Ensure proper heat sinking and thermal design to prevent thermal shutdown.
A 10 μF ceramic capacitor with an ESR of 1 Ω or less is recommended. Ensure the capacitor is placed close to the VCC pin.
NX7002AK,215 datasheet
by NXP Semiconductors
