A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the device. Refer to NXP's application note AN11524 for more details.
Use a thermal pad or thermal interface material to improve heat dissipation. Ensure good airflow and avoid blocking the thermal pad. Follow NXP's thermal design guidelines and consider using a heat sink if necessary.
The internal voltage regulator has a limited current capability (typically 50mA). It's recommended to use an external voltage regulator for higher current requirements. Also, be aware of the voltage regulator's dropout voltage and power-on reset (POR) threshold.
Use the device's low-power modes (e.g., sleep, standby) whenever possible. Optimize your firmware to minimize active mode duration and use the lowest possible clock frequency. Consider using a power gating technique to reduce power consumption.
Follow NXP's ESD protection guidelines, including using ESD protection diodes, resistors, and capacitors. Ensure that the PCB layout and component placement minimize ESD exposure. Use an ESD-protected socket or handler during production and testing.