The recommended land pattern for the NTCS0805E4104JMT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E4104JMT has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The maximum operating voltage for the NTCS0805E4104JMT is 50 V. Exceeding this voltage may damage the component.
Store the NTCS0805E4104JMT in a dry, cool place, away from direct sunlight. Use airtight packaging or a dry nitrogen-filled package to prevent moisture absorption.
The recommended reflow soldering profile for the NTCS0805E4104JMT is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C.
