NTCS0805E3103JLT datasheet by Vishay BCcomponents

NTCS0805E3103JLT Frequently Asked Questions (FAQs)

• What is the recommended land pattern for NTCS0805E3103JLT?
  The recommended land pattern for NTCS0805E3103JLT is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
• Can I use NTCS0805E3103JLT in a high-temperature environment?
  While NTCS0805E3103JLT is rated for operation up to 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. This is because the component's reliability and accuracy may be compromised above this temperature.
• How do I handle the component during assembly to prevent damage?
  To prevent damage, handle NTCS0805E3103JLT by the edges, avoid touching the component's surface, and use an anti-static wrist strap or mat. Also, ensure that the component is not subjected to excessive mechanical stress, such as bending or flexing.
• What is the recommended soldering profile for NTCS0805E3103JLT?
  The recommended soldering profile for NTCS0805E3103JLT is a peak temperature of 260°C, with a dwell time of 10-30 seconds. This ensures that the component is properly soldered without damaging the internal structure.
• Can I use NTCS0805E3103JLT in a humid environment?
  While NTCS0805E3103JLT is not hermetically sealed, it is designed to operate in a humid environment. However, it's recommended to follow proper humidity protection measures, such as conformal coating or potting, to ensure the component's reliability.