The recommended land pattern for the NTCS0805E3103JHT is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E3103JHT has a thermal resistance of 250°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The maximum operating voltage for the NTCS0805E3103JHT is 25V. Exceeding this voltage may damage the component.
To ensure reliability, follow the recommended derating guidelines for temperature and voltage, and ensure good thermal management. Also, consider using a thermally conductive adhesive or thermal interface material to improve heat transfer.
The NTCS0805E3103JHT has an MSL rating of 1, which means it can withstand normal humidity levels without special handling or storage requirements.