The recommended land pattern for NTCS0805E3103HLT is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While NTCS0805E3103HLT has a high operating temperature range of -55°C to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum power rating at high temperatures. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
NTCS0805E3103HLT is an ESD-sensitive device. To prevent damage, handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the PCB and assembly process also follow ESD-safe practices.
Store NTCS0805E3103HLT in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity below 60%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.
While NTCS0805E3103HLT is not hermetically sealed, it is designed to operate in a humid environment. However, it's essential to follow proper PCB design and assembly practices to prevent moisture ingress and ensure reliable operation.
