NTCS0805E3103GMT datasheet by Vishay BCcomponents

NTCS0805E3103GMT Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the NTCS0805E3103GMT?
  The recommended land pattern for the NTCS0805E3103GMT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
• How do I handle the thermal considerations for the NTCS0805E3103GMT?
  To handle thermal considerations, ensure a good thermal connection to a copper plane or a thermal via, and consider using a thermal interface material (TIM) to improve heat transfer.
• What is the maximum power rating for the NTCS0805E3103GMT?
  The maximum power rating for the NTCS0805E3103GMT is 1.5 W, but it's recommended to derate the power to 1 W or less to ensure reliable operation.
• Can I use the NTCS0805E3103GMT in a high-vibration environment?
  Yes, the NTCS0805E3103GMT is suitable for high-vibration environments, but ensure proper mounting and soldering to prevent mechanical stress and vibration-induced failures.
• How do I ensure the reliability of the NTCS0805E3103GMT in high-temperature applications?
  To ensure reliability, follow the recommended operating temperature range (-55°C to 150°C), and consider using a thermally conductive adhesive or thermal interface material to improve heat transfer.