The recommended land pattern for the NTCS0805E3103FMT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E3103FMT has a thermal resistance of 350 K/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating the component.
The recommended soldering profile for the NTCS0805E3103FMT is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C.
To ensure reliability in high-humidity environments, apply a conformal coating to the component, and follow the recommended storage and handling procedures to prevent moisture absorption.
The NTCS0805E3103FMT has an ESD sensitivity of 2 kV human body model (HBM) and 150 V machine model (MM). Handle the component with ESD precautions, such as using an ESD wrist strap or mat.
