The recommended land pattern for NTCS0402E3473FXT is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a solder mask clearance of 0.1 mm. This is to ensure proper soldering and to prevent solder bridging.
While NTCS0402E3473FXT is rated for operation up to 150°C, it's not recommended for continuous operation above 125°C. Prolonged exposure to high temperatures can affect the component's reliability and lifespan.
Handle NTCS0402E3473FXT by the edges to prevent damage to the component's termination. Avoid touching the component's surface, as the oils from human skin can affect solderability. Use ESD-safe handling and storage procedures to prevent electrostatic discharge damage.
The recommended soldering profile for NTCS0402E3473FXT is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
While NTCS0402E3473FXT is not hermetically sealed, it is designed to operate in a humid environment. However, it's recommended to follow proper PCB design and assembly practices to prevent moisture ingress and ensure reliable operation.
