The recommended land pattern for NTCS0402E3104JHT is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While NTCS0402E3104JHT is rated for operation up to 150°C, it's not recommended to use it in high-temperature environments above 125°C for extended periods. This is because the component's reliability and accuracy may be compromised above this temperature.
To prevent damage, handle NTCS0402E3104JHT by the edges, avoid touching the component's surface, and use an anti-static wrist strap or mat. Also, ensure that the component is not subjected to excessive mechanical stress, such as bending or flexing.
The recommended soldering profile for NTCS0402E3104JHT is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper soldering and minimizes the risk of component damage.
While NTCS0402E3104JHT is not hermetically sealed, it is designed to operate in a humid environment. However, it's recommended to follow proper PCB design and assembly guidelines to prevent moisture ingress and ensure reliable operation.
Findchips
Findchips