A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for good airflow.
The N24C16UVTG requires a specific power-up and power-down sequencing to prevent damage. It's recommended to power up the VCC supply before the VPP supply, and power down the VPP supply before the VCC supply. A soft-start circuit can also be used to control the power-up sequence.
For high-reliability or high-temperature applications, it's essential to consider the device's operating temperature range, thermal management, and potential derating. Additionally, onsemi provides a range of reliability and quality grades for the N24C16UVTG, such as the 'Q' or 'V' grades, which can be specified for high-reliability applications.
To ensure EMC and EMI compliance, it's recommended to follow proper PCB layout and design practices, such as using a solid ground plane, minimizing signal loop areas, and using shielding or filtering components as needed. Additionally, onsemi provides guidance on EMC and EMI considerations in their application notes and design resources.
Common failure modes for the N24C16UVTG include overvoltage, overcurrent, and overheating. To mitigate these failure modes, it's essential to implement proper voltage and current limiting, thermal management, and protection circuits, such as overvoltage protection (OVP) and overcurrent protection (OCP) devices.
N24C16UVTG datasheet
by onsemi
