SL Power Electronics recommends a multi-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1W/m-K or higher is suggested between the module and the heat sink.
To ensure EMC, SL Power Electronics recommends following proper PCB layout and design guidelines, using a metal enclosure, and implementing EMI filtering and shielding. Additionally, the module should be installed in a way that minimizes radiation and conduction of electromagnetic interference.
The derating curve for the MW155RA2451F01 is typically provided in the application notes or can be obtained from SL Power Electronics directly. The derating curve shows the reduction in output power as a function of temperature, and it's essential to consider this when designing the system to ensure reliable operation.
Yes, the MW155RA2451F01 can be used in a redundant or parallel configuration, but it's essential to follow SL Power Electronics' guidelines and recommendations for synchronization, current sharing, and fault detection to ensure reliable operation and minimize the risk of damage or failure.
SL Power Electronics recommends using input and output filtering components that meet the module's specifications and are designed to reduce electromagnetic interference (EMI) and radio-frequency interference (RFI). The recommended components and their values can be found in the application notes or obtained from SL Power Electronics directly.
