The recommended soldering temperature profile for the MUR860 is a peak temperature of 260°C for 10 seconds, with a preheat temperature of 150°C to 200°C and a cooling rate of 4°C/s to 6°C/s.
Yes, the MUR860 can be used in high-frequency applications up to 1 MHz due to its low capacitance and fast switching time. However, it's essential to consider the diode's parasitic inductance and capacitance when designing the circuit.
The MUR860 can withstand high-temperature storage conditions up to 150°C for 1000 hours without significant degradation. However, it's recommended to store the devices in a dry, cool place to prevent moisture absorption and oxidation.
The recommended PCB layout and land pattern for the MUR860 involve using a thermal relief pad with a diameter of 1.5 mm to 2.5 mm, and a solder mask opening of 0.5 mm to 1.5 mm. The land pattern should also include a thermal via to improve heat dissipation.
Yes, the MUR860 can be used in automotive applications due to its high reliability, high-temperature rating, and compliance with AEC-Q101 standards. However, it's essential to ensure that the device meets the specific requirements of the automotive application.
