MP8762HGLE-Z datasheet by Monolithic Power Systems

MP8762HGLE-Z Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A good PCB layout for the MP8762HGLE-Z should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure that the thermal vias are connected to a solid copper plane on the bottom layer. Keep the input and output capacitors close to the device to minimize parasitic inductance.
• How do I optimize the output voltage accuracy?
  To optimize output voltage accuracy, ensure that the feedback resistors (RFBT and RFBG) are of high precision (1% or better) and have a low temperature coefficient. Also, keep the feedback network as close to the device as possible to minimize noise and parasitic effects.
• What is the recommended input capacitor type and value?
  A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 4.7uF to 10uF is recommended for the input capacitor. This helps to filter out high-frequency noise and ensure stable operation.
• How do I handle the device's enable pin (EN) during power-up and power-down sequences?
  The enable pin (EN) should be pulled high during power-up and pulled low during power-down sequences to ensure proper device operation. A soft-start circuit can be implemented to control the EN pin and prevent inrush currents.
• What is the maximum allowed output current during a short-circuit event?
  The MP8762HGLE-Z has a built-in overcurrent protection (OCP) feature that limits the output current to 2.5A during a short-circuit event. However, it's recommended to add an external current-sensing resistor to detect overcurrent conditions and prevent damage to the device.