A good PCB layout for the MP28259DD-LF-Z should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure that the thermal vias are connected to a solid copper plane on the bottom layer. Keep the input and output capacitors close to the device to minimize parasitic inductance.
Choose input capacitors with low ESR (Equivalent Series Resistance) and high ripple current rating to minimize voltage ripple and ensure stable operation. For output capacitors, select ones with low ESR and high capacitance to reduce output voltage ripple and improve transient response. Consult the datasheet for recommended capacitor values and types.
The MP28259DD-LF-Z can tolerate a maximum voltage deviation of ±10% on the input pin (VIN) without affecting its performance. However, it's recommended to keep the input voltage within ±5% for optimal performance and reliability.
To ensure proper power-up and power-down, follow the recommended power sequencing in the datasheet. Apply the input voltage (VIN) before the enable signal (EN), and remove the enable signal before the input voltage during power-down. This prevents unwanted current surges and ensures reliable operation.
The MP28259DD-LF-Z is rated for operation from -40°C to +125°C (junction temperature). However, it's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance and reliability.
MP28259DD-LF-Z datasheet
by Monolithic Power Systems
