The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and using thermal vias to connect the exposed pad to the ground plane. Additionally, keeping the input and output capacitors close to the device and using short, wide traces can help reduce thermal resistance.
To ensure stability and prevent oscillations in the output voltage, it is recommended to use a minimum output capacitance of 10uF with an ESR of less than 1 ohm, and to place the output capacitor close to the device. Additionally, using a low-ESR input capacitor and keeping the input and output traces short and separate can help prevent oscillations.
The maximum allowed input voltage ripple for the MP20073DH-LF is 10% of the input voltage, or 1.5V, whichever is smaller. Exceeding this limit may affect the device's performance and reliability.
The MP20073DH-LF is rated for operation up to 125°C, but the device's performance and reliability may be affected at high temperatures. It is recommended to derate the output current and input voltage according to the datasheet's thermal derating curves to ensure reliable operation in high-temperature environments.
The power dissipation of the MP20073DH-LF can be calculated using the formula: Pd = (Vin * Iin) - (Vout * Iout), where Vin is the input voltage, Iin is the input current, Vout is the output voltage, and Iout is the output current. The resulting value should be derated according to the datasheet's thermal derating curves to ensure reliable operation.
MP20073DH-LF datasheet
by Monolithic Power Systems
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