A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. A thermal pad on the bottom of the device should be connected to a solid ground plane or a thermal relief pattern.
Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Consider using a pi-network or a T-network topology, and optimize component values using a Smith chart or a circuit simulator.
Use a voltage regulator to stabilize the supply voltage, and consider using a bias-T network to provide a stable bias voltage. Ensure the bias voltage is within the recommended range, and consider using a temperature compensation network to stabilize the bias point.
Use a shielded enclosure, and ensure the PCB layout is optimized for EMI reduction. Use decoupling capacitors and ferrite beads to filter out high-frequency noise, and consider using a common-mode choke to reduce EMI radiation.
Perform environmental tests such as temperature cycling, humidity, and vibration testing. Also, perform electrical tests such as gain compression, noise figure, and return loss measurements to ensure the device meets the required specifications.
