The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the device, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat to the other side of the board.
To ensure reliable operation in high-vibration environments, it is recommended to use a secure mounting method, such as screwing or adhesive, and to follow the manufacturer's guidelines for vibration testing and qualification.
The MFL2805S/883 is a radiation-hardened device, but it still has limitations in terms of total ionizing dose (TID) and single-event effects (SEEs). The specific limitations can be found in the manufacturer's radiation report or by contacting their technical support.
Yes, the MFL2805S/883 can be used in non-space applications that require high reliability and radiation tolerance, such as in industrial or medical devices. However, it is essential to ensure that the device meets the specific requirements of the application and to follow the manufacturer's guidelines for use in non-space environments.
The testing and screening procedures used to ensure the device meets the 883 specification include burn-in, electrical testing, and environmental testing, such as temperature cycling and vibration testing, as well as radiation testing and qualification.
MFL2805S/883 datasheet
by Interpoint
