STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
Implement a thermal management system, such as a heat sink or fan, to keep the junction temperature below 150°C. Also, ensure good airflow and avoid thermal hotspots.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling, placed as close to the device as possible.
Use a shielded enclosure, keep the layout compact, and use a common-mode choke or ferrite bead on the input lines to reduce EMI emissions.
The maximum allowed voltage drop is 0.5V, but it's recommended to keep it below 0.3V to ensure reliable operation.