MC3487DRE4 datasheet by Texas Instruments

MC3487DRE4 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Texas Instruments recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer to improve thermal performance. Additionally, it's recommended to have a minimum of 10 vias under the package to connect the thermal pad to the ground plane.
• How do I ensure reliable operation at high temperatures?
  To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range and power dissipation limits.
• What is the maximum allowed voltage on the VCC pin?
  Although the datasheet specifies a recommended operating voltage range of 4.5V to 5.5V, the absolute maximum rating for the VCC pin is 6.5V. However, it's essential to note that operating the device at voltages above 5.5V may affect its reliability and performance.
• How do I handle ESD protection for the MC3487DRE4?
  The MC3487DRE4 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during manufacturing and assembly. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD protection devices such as TVS diodes or ESD suppressors.
• What is the recommended capacitor value for the VCC bypass capacitor?
  Texas Instruments recommends using a 0.1uF to 1uF ceramic capacitor with a voltage rating of 10V or higher as a VCC bypass capacitor. The capacitor should be placed as close as possible to the VCC pin and connected to the ground plane.