MC3487DE4 datasheet by Texas Instruments

MC3487DE4 Frequently Asked Questions (FAQs)

• What is the recommended layout and placement for the MC3487DE4?
  Texas Instruments recommends a 4-layer PCB with a solid ground plane, and placing the device close to the battery to minimize noise and EMI. Decoupling capacitors should be placed as close as possible to the device pins.
• How do I ensure the MC3487DE4 is properly powered up and initialized?
  The device requires a power-on reset (POR) to ensure proper initialization. A 10uF capacitor between VCC and GND, and a 1kΩ resistor between VCC and EN (enable) pin can help achieve a clean power-up sequence.
• What is the maximum current rating for the MC3487DE4's output stages?
  The maximum current rating for the output stages is 1.5A per channel, but this can be limited by the package thermal resistance and PCB thermal design. Ensure proper thermal management to prevent overheating.
• How do I configure the MC3487DE4 for low-power or sleep modes?
  The device has a shutdown mode (SHDN) that can be controlled through the EN pin. Additionally, the device can be configured for low-power modes by adjusting the clock frequency, disabling unused features, and using the power-saving modes (PS0-PS2) available in the device.
• What are the key considerations for EMI and noise reduction when using the MC3487DE4?
  Use a 4-layer PCB with a solid ground plane, keep the device away from noise sources, use decoupling capacitors, and ensure proper routing of high-frequency signals. Additionally, use shielding and filtering techniques to minimize EMI and noise.