Freescale provides a recommended PCB layout in the application note AN1568, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize signal integrity issues.
The MC100ES6111FAR2 has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink. Additionally, the PCB design should ensure good airflow and thermal conduction to prevent overheating.
The input termination resistors should be 50 ohms, 1% tolerance, and located as close as possible to the device pins. The resistors should also be capable of handling the high-frequency signals and have a low inductance to minimize signal reflections.
To ensure signal integrity, the output lines should be routed as differential pairs, with a controlled impedance of 50 ohms and a length that is matched to within 1 mm. The lines should also be shielded from noise sources and have a low capacitance to minimize signal distortion.
A recommended power supply decoupling scheme includes a 10 uF capacitor in parallel with a 100 nF capacitor, both located close to the device power pins. This scheme helps to filter out noise and ensure a stable power supply to the device.
MC100ES6111FAR2 datasheet
by Freescale Semiconductor
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