The recommended PCB footprint for the MBRB745HE3/45 is a standard SMC (Surface Mount Component) footprint with a pad size of 4.5mm x 2.5mm and a spacing of 1.5mm between pads.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pads. Also, make sure the PCB is clean and free of oxidation.
The maximum allowable voltage derating for the MBRB745HE3/45 is 10% of the rated voltage, which is 45V. Therefore, the maximum allowable voltage derating is 4.5V.
The MBRB745HE3/45 is rated for operation up to 150°C. However, it's recommended to derate the voltage and current ratings according to the temperature derating curve provided in the datasheet to ensure reliable operation.
To prevent ESD damage, handle the MBRB745HE3/45 with an ESD wrist strap or mat, and ensure that the PCB and components are properly grounded. Also, avoid touching the component pins or PCB traces.