MBRB2545CT-E3/45 datasheet by Vishay Semiconductors

MBRB2545CT-E3/45 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for MBRB2545CT-E3/45?
  The recommended PCB footprint for MBRB2545CT-E3/45 is a standard SMC (Surface Mount Component) footprint with a pad size of 5.5mm x 2.5mm and a spacing of 1.5mm between pads.
• Can I use MBRB2545CT-E3/45 in a high-temperature environment?
  While the MBRB2545CT-E3/45 has a maximum operating temperature of 150°C, it's recommended to derate the voltage and current ratings above 125°C to ensure reliable operation. Consult the datasheet and application notes for more information.
• How do I ensure the reliability of MBRB2545CT-E3/45 in a high-humidity environment?
  To ensure reliability in high-humidity environments, follow proper PCB design and assembly guidelines, including using a moisture-resistant coating, conformal coating, or potting. Additionally, consider using a humidity sensor and implementing humidity-related protection circuits.
• What is the recommended soldering profile for MBRB2545CT-E3/45?
  The recommended soldering profile for MBRB2545CT-E3/45 is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. Consult the datasheet and application notes for more information.
• Can I use MBRB2545CT-E3/45 in a high-vibration environment?
  While the MBRB2545CT-E3/45 is designed to withstand normal vibration levels, it's recommended to follow proper PCB design and assembly guidelines, including using a secure mounting method and ensuring the component is properly anchored to the PCB.