The recommended PCB footprint for MBRB2045CT-E3/81 is a standard SOT-23 package with a minimum pad size of 1.3 mm x 1.3 mm and a maximum pad size of 1.5 mm x 1.5 mm, with a 0.5 mm spacing between pads.
While the MBRB2045CT-E3/81 has a maximum operating temperature of 150°C, it's recommended to derate the power dissipation at higher temperatures to ensure reliability. Consult the datasheet for thermal impedance and power derating curves.
To ensure reliability in high-humidity environments, follow proper PCB design and assembly guidelines, including using a moisture-resistant coating, conformal coating, or potting. Additionally, consider using a humidity sensor to monitor the environment and take corrective action if necessary.
The recommended soldering profile for MBRB2045CT-E3/81 is a peak temperature of 260°C for 10-30 seconds, with a maximum temperature ramp rate of 3°C/s. Consult the datasheet for more detailed soldering guidelines.
While the MBRB2045CT-E3/81 is a robust component, it's recommended to follow proper PCB design and assembly guidelines to ensure reliability in high-vibration environments. Consider using a vibration-resistant coating or potting, and ensure the PCB is securely fastened to the chassis.
MBRB2045CT-E3/81 datasheet
by Vishay Semiconductors
