The recommended PCB footprint for the MBR5H150VPTR-E1 is a standard SOT223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliable operation of the MBR5H150VPTR-E1 in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermal interface material, and keeping the junction temperature below the maximum rated value of 150°C.
The maximum allowed voltage spike for the MBR5H150VPTR-E1 is 10% above the maximum rated voltage of 150V, which is 165V. However, it is recommended to follow the voltage rating and not exceed it to ensure reliable operation.
Yes, the MBR5H150VPTR-E1 can be used in a switching power supply application due to its fast switching speed and low reverse recovery time. However, it is recommended to follow proper design guidelines and ensure that the device is operated within its safe operating area (SOA).
The power dissipation of the MBR5H150VPTR-E1 can be calculated using the formula: Pd = (Vf x If) + (Vr x Ir), where Vf is the forward voltage drop, If is the forward current, Vr is the reverse voltage, and Ir is the reverse current. The maximum power dissipation rating is 50W.
MBR5H150VPTR-E1 datasheet
by Diodes Incorporated
