The recommended PCB footprint for the MBR30100CT-LJ is a standard SOT-23 package with a 1.5mm x 1.5mm pad size, and a 0.5mm x 0.5mm thermal pad in the center.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and keeping the junction temperature below the maximum rated value of 150°C.
The maximum allowed voltage on the anode and cathode pins is 100V, as specified in the datasheet. Exceeding this voltage may damage the device.
Yes, the MBR30100CT-LJ can be used in switching applications, but it's essential to ensure that the device is properly biased and that the switching frequency is within the recommended range to avoid overheating and reduce electromagnetic interference (EMI).
The power dissipation of the MBR30100CT-LJ can be calculated using the formula: Pd = (Vf x If) + (Vr x Ir), where Vf is the forward voltage, If is the forward current, Vr is the reverse voltage, and Ir is the reverse current.
