The recommended PCB layout for the MBR30100CT-E1 includes using a solid ground plane, keeping the input and output traces separate, and minimizing the length of the leads to reduce inductance. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.
To ensure the reliability of the MBR30100CT-E1 in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, use a heat sink if necessary, and ensure good thermal conductivity between the device and the PCB. Additionally, the device should be operated within the recommended operating conditions and the maximum junction temperature should not be exceeded.
The MBR30100CT-E1 has an ESD rating of 2kV per the Human Body Model (HBM) and 150V per the Machine Model (MM). To ensure ESD protection, it is recommended to follow proper handling and storage procedures, use ESD-protective packaging and materials, and implement ESD protection circuits in the system design.
Yes, the MBR30100CT-E1 can be used in parallel to increase the current handling capability. However, it is recommended to ensure that the devices are properly matched and that the current sharing is balanced to prevent overheating and reduce the risk of thermal runaway.
The recommended soldering conditions for the MBR30100CT-E1 include a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering iron temperature of 350°C or less. It is also recommended to use a solder with a melting point of 180°C or higher.
MBR30100CT-E1 datasheet
by Diodes Incorporated
