The recommended PCB footprint and land pattern for the MBR20H100CTF-E1 can be found in the Diodes Incorporated application note AN154, which provides detailed guidelines for PCB layout and assembly.
To ensure reliability in high-temperature applications, it is essential to follow the recommended derating guidelines for the MBR20H100CTF-E1, which can be found in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
The maximum allowable voltage stress for the MBR20H100CTF-E1 during switching transitions is dependent on the specific application and operating conditions. As a general guideline, it is recommended to limit the voltage stress to 10% above the maximum rated voltage to ensure reliable operation.
Yes, the MBR20H100CTF-E1 can be used in a parallel configuration to increase current handling capability. However, it is essential to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and reliability issues.
The recommended ESD protection for the MBR20H100CTF-E1 during handling and assembly includes using ESD-safe materials, such as wrist straps, mats, and packaging, as well as following proper handling and storage procedures to prevent electrostatic discharge.
MBR20H100CTF-E1 datasheet
by Diodes Incorporated
