A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the manufacturer's application note for detailed layout guidelines.
Ensure proper heat sinking, use a thermally conductive material for the PCB, and follow the recommended operating conditions. Derate the device's power dissipation according to the temperature derating curve provided in the datasheet.
The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
Yes, but ensure that the device is operated within its recommended frequency range and follow the manufacturer's guidelines for high-frequency operation. Additionally, consider the effects of parasitic inductance and capacitance on the device's performance.
Store the devices in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C, and the relative humidity should be below 60%.
MBR15100CT datasheet
by Taiwan Semiconductor
