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    Part Img MAX6767TALD2+T datasheet by Maxim Integrated Products

    • PMIC - Supervisors, Integrated Circuits (ICs), IC REG LINEAR 5V/ADJ 8TDFN
    • Original
    • Yes
    • Yes
    • Transferred
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com
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    MAX6767TALD2+T datasheet preview

    MAX6767TALD2+T Frequently Asked Questions (FAQs)

    • The recommended PCB layout for the MAX6767TALD2+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a separate analog ground plane and to keep the digital and analog signals separate to reduce noise and interference.
    • To ensure the MAX6767TALD2+T is properly powered up and initialized, make sure to follow the power-up sequence specified in the datasheet, which involves applying the input voltage (VIN) before the enable signal (EN). Also, ensure that the input voltage is within the recommended operating range and that the device is properly bypassed with capacitors.
    • The maximum output current capability of the MAX6767TALD2+T is 150mA. However, it's recommended to derate the output current based on the ambient temperature and the desired output voltage to ensure reliable operation and to prevent overheating.
    • To troubleshoot issues with the MAX6767TALD2+T, start by verifying the input voltage and enable signal are within the recommended operating range. Check the output voltage and current using an oscilloscope or multimeter, and ensure that the device is properly bypassed with capacitors. Also, check for any signs of overheating, such as excessive temperature or thermal shutdown. If the issue persists, consult the datasheet and application notes for further guidance.
    • The MAX6767TALD2+T is rated for operation up to 125°C, but it's recommended to derate the output current and voltage based on the ambient temperature to ensure reliable operation. Additionally, ensure that the device is properly heat-sinked and that the PCB is designed to handle high temperatures.
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