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    Part Img MAX4754ETE+T datasheet by Maxim Integrated Products

    • 0.5 Ohm, Quad SPDT Switches in UCSP/QFN
    • Original
    • Yes
    • Yes
    • Transferred
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    MAX4754ETE+T datasheet preview

    MAX4754ETE+T Frequently Asked Questions (FAQs)

    • The recommended PCB layout for the MAX4754ETE+T involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
    • The MAX4754ETE+T requires a single 3.3V or 5V power supply. It's recommended to power the device with a clean, low-noise power supply, and to ensure that the power supply is stable before applying any input signals. The power sequencing requirements are not critical, but it's recommended to power the device after the input signals are stable.
    • The MAX4754ETE+T has an operating temperature range of -40°C to +125°C. However, the device's performance may degrade at extreme temperatures, and it's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance.
    • To troubleshoot common issues with the MAX4754ETE+T, start by checking the power supply voltage and ensuring it's within the recommended range. Next, verify that the input signals are within the recommended range and that the device is properly configured. If the issue persists, check for any layout or routing issues on the PCB, and ensure that the device is properly decoupled. If the issue still persists, consult the datasheet and application notes for further troubleshooting guidance.
    • The MAX4754ETE+T has built-in ESD protection diodes on all pins, which can withstand up to 2kV of ESD voltage. To prevent latch-up, it's recommended to follow proper PCB design and layout guidelines, such as keeping the input and output traces separate, using a solid ground plane, and avoiding any potential latch-up paths.
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