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    Part Img MAX16058ATA19+T datasheet by Maxim Integrated Products

    • 125nA Supervisory Circuits with Capacitor-Adjustable Reset and Watchdog Timeouts; Package: Land Pattern: Not Available; Temperature: -40°C to +125°C
    • Original
    • Yes
    • Yes
    • Obsolete
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com

    MAX16058ATA19+T datasheet preview

    MAX16058ATA19+T Frequently Asked Questions (FAQs)

    • The recommended PCB layout for the MAX16058ATA19+T involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
    • To ensure proper power-up and initialization of the MAX16058ATA19+T, it's recommended to follow a power-up sequence that includes a slow ramp-up of the input voltage (typically 10ms to 100ms) and a delay of at least 10ms after power-up before enabling the device. Additionally, the EN pin should be tied to a logic high to enable the device.
    • The MAX16058ATA19+T can drive a maximum capacitive load of 10nF. Exceeding this limit may result in instability or oscillations. If a larger capacitive load is required, an external buffer or amplifier may be necessary.
    • To troubleshoot issues with the MAX16058ATA19+T, start by verifying the power supply voltage and ensuring that it's within the recommended range. Check the input and output voltages using an oscilloscope to identify any anomalies. Also, verify that the device is properly configured and that the EN pin is tied to a logic high. If issues persist, consult the datasheet and application notes for guidance or contact Maxim Integrated Products' technical support.
    • The MAX16058ATA19+T is rated for operation up to 125°C, but it's recommended to derate the device's performance at high temperatures. Consult the datasheet and application notes for guidance on using the device in high-temperature applications, and consider using thermal management techniques such as heat sinks or thermal interfaces to ensure reliable operation.
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