Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    MAX14983EETJ+T datasheet by Maxim Integrated Products

    • Interface - Analog Switches, Multiplexers, Demultiplexers, Integrated Circuits (ICs), IC MUX ENH 1:2 VGA MUX QFN
    • Original
    • Yes
    • Unknown
    • Transferred
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com

    MAX14983EETJ+T datasheet preview

    MAX14983EETJ+T Frequently Asked Questions (FAQs)

    • The recommended PCB layout for the MAX14983EETJ+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals to minimize noise and interference.
    • The MAX14983EETJ+T requires a single 3.3V power supply, and it's recommended to use a low-noise, low-dropout regulator (LDO) to power the device. The power sequencing requirements involve powering up the device in the following order: VCC, then VDD, and finally the digital inputs. It's also recommended to add decoupling capacitors close to the device to filter out noise and ripple.
    • The MAX14983EETJ+T has an operating temperature range of -40°C to +125°C. The device's performance may be affected at higher temperatures, with a decrease in accuracy and an increase in power consumption. It's recommended to use thermal management techniques, such as heat sinks or thermal pads, to keep the device within a safe operating temperature range.
    • To troubleshoot common issues with the MAX14983EETJ+T, start by checking the power supply and ensuring it's within the recommended range. Verify that the device is properly configured and that the input signals are correct. Use an oscilloscope to check the output voltages and waveforms, and consult the datasheet for troubleshooting guidelines specific to the device.
    • Yes, the MAX14983EETJ+T is a high-frequency device and requires careful consideration of EMI/EMC during the design process. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference and ensure compliance with regulatory requirements. Additionally, follow the recommended PCB layout and routing guidelines to minimize radiation and coupling.
    Price & Stock Powered by Findchips Logo
    Supplyframe Tracking Pixel