MAX1490BEPG+ datasheet by Maxim Integrated Products

MAX1490BEPG+ Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the MAX1490BEPG+ to minimize EMI?
  A good PCB layout for the MAX1490BEPG+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, use a shielded cable for the USB connection and keep the USB traces away from the analog signals.
• How do I ensure reliable communication between the MAX1490BEPG+ and the USB host?
  To ensure reliable communication, use a USB cable with a shielded twisted pair, keep the cable length under 3 meters, and use a USB hub with a high-quality signal repeater if necessary. Also, ensure that the MAX1490BEPG+ is properly configured and initialized before attempting communication.
• What are the power sequencing requirements for the MAX1490BEPG+?
  The MAX1490BEPG+ requires a specific power sequencing to prevent latch-up and ensure proper operation. The recommended power-up sequence is: VCC, then VDD, then VBUS. The power-down sequence should be reversed.
• How do I handle the MAX1490BEPG+ during power-down or reset?
  During power-down or reset, ensure that the MAX1490BEPG+ is properly shut down by disabling the USB transceiver and putting the device into a low-power state. This helps prevent damage to the device and ensures reliable operation.
• What are the thermal considerations for the MAX1490BEPG+?
  The MAX1490BEPG+ has a maximum junction temperature of 150°C. Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Also, follow the recommended PCB layout guidelines to minimize thermal resistance.