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    Part Img MAX1188AEUP+ datasheet by Maxim Integrated Products

    • 16-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range
    • Original
    • Yes
    • Yes
    • Obsolete
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    MAX1188AEUP+ datasheet preview

    MAX1188AEUP+ Frequently Asked Questions (FAQs)

    • The recommended layout and routing for the MAX1188AEUP+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog input traces. Additionally, the device should be placed close to the analog signal sources, and the digital output traces should be routed away from the analog input traces to minimize digital noise coupling.
    • The power-up sequence for the MAX1188AEUP+ should follow the recommended sequence in the datasheet, which is to power up the analog supply (VCC) before the digital supply (VDD). This ensures that the internal analog circuitry is powered up before the digital circuitry, which helps to prevent any potential issues with the device's operation.
    • The maximum clock frequency for the MAX1188AEUP+ is 50MHz. Using a higher clock frequency may result in increased power consumption, reduced signal-to-noise ratio, and potential issues with the device's operation. It is recommended to use a clock frequency that is within the specified range to ensure optimal performance and reliability.
    • The MAX1188AEUP+ outputs data in a parallel format, with the option to use a serial interface through the use of an external serializer. The output data format and timing should be carefully considered to ensure compatibility with the downstream device. Using different output formats may require additional circuitry or processing, and may impact the overall system performance and power consumption.
    • The MAX1188AEUP+ has a maximum junction temperature of 150°C, and the device should be operated within the recommended temperature range to ensure reliable operation. Thermal management considerations include providing adequate heat sinking, using a thermally conductive PCB material, and minimizing power consumption. Additionally, the device should be operated within the recommended power supply voltage range to minimize power consumption and heat generation.
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