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    Part Img MAX1110EAP+T datasheet by Maxim Integrated Products

    • +2.7V, Low-Power, Multichannel, Serial, 8-Bit ADCs
    • Original
    • Yes
    • Yes
    • Transferred
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
    • Find it at Findchips.com

    MAX1110EAP+T datasheet preview

    MAX1110EAP+T Frequently Asked Questions (FAQs)

    • To minimize noise and ensure optimal performance, it is recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and use a solid ground plane. Additionally, keep the analog input traces short and away from digital signals, and use a low-ESR capacitor for the AVDD pin.
    • To calibrate the MAX1110EAP+T, apply a known input voltage to the device, then adjust the offset and gain registers to achieve the desired output code. It is recommended to use a calibration routine that takes into account the device's internal offset and gain errors, as well as any external errors introduced by the PCB and components.
    • The maximum sampling rate of the MAX1110EAP+T is 1Msps. However, the power consumption increases with the sampling rate, so it is recommended to optimize the sampling rate based on the specific application requirements to minimize power consumption. A higher sampling rate may also require additional filtering and decimation to achieve the desired signal-to-noise ratio.
    • The MAX1110EAP+T has built-in overvoltage protection (OVP) and undervoltage protection (UVP) mechanisms. The OVP circuitry limits the input voltage to prevent damage to the device, while the UVP circuitry prevents the device from operating below the minimum specified voltage. Additionally, the device has a power-on reset (POR) circuit that resets the device in case of a power failure or brownout condition.
    • The recommended operating temperature range for the MAX1110EAP+T is -40°C to +85°C. Temperature affects the device's performance, with increased temperature resulting in increased offset voltage, gain error, and noise. It is recommended to use thermal management techniques, such as heat sinking and thermal interface materials, to maintain a stable temperature and ensure optimal performance.
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