The recommended layout and placement for the MAX1011CEG+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane.
The MAX1011CEG+ has a thermal pad that must be connected to a thermal relief pattern on the PCB to ensure proper heat dissipation. The thermal pad should be connected to a large copper area on the PCB, and the PCB should be designed to minimize thermal resistance.
The recommended input filtering for the MAX1011CEG+ involves using a low-pass filter with a cutoff frequency of around 100kHz to 1MHz to remove high-frequency noise. The recommended output filtering involves using a low-pass filter with a cutoff frequency of around 10kHz to 100kHz to remove high-frequency noise and improve signal quality.
To ensure EMC with the MAX1011CEG+, it's recommended to use a shielded enclosure, keep the analog and digital circuits separate, and use a common-mode choke or ferrite bead to filter the power supply lines. Additionally, the PCB should be designed to minimize radiation and susceptibility to electromagnetic interference.
The recommended power-up and power-down sequencing for the MAX1011CEG+ involves powering up the analog power supply (AVCC) before the digital power supply (DVCC), and powering down the digital power supply before the analog power supply. This ensures that the analog circuitry is powered up and stable before the digital circuitry is powered up.
MAX1011CEG+ datasheet
by Maxim Integrated Products
Findchips
Findchips