The recommended land pattern for MAL202116472E3 is a rectangular pad with a size of 2.5 mm x 1.25 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While the MAL202116472E3 is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the component's reliability and lifespan may be affected by prolonged exposure to high temperatures.
To prevent damage, store the MAL202116472E3 in its original packaging or a similar protective container. Avoid exposing the component to moisture, extreme temperatures, or physical stress during shipping and storage. Follow the ESD (Electrostatic Discharge) handling precautions to prevent damage from static electricity.
The recommended soldering profile for MAL202116472E3 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
While the MAL202116472E3 is designed to operate in a variety of environments, it's essential to consider the component's moisture sensitivity level (MSL) rating. The MAL202116472E3 has an MSL rating of 3, which means it can withstand some humidity, but prolonged exposure to high humidity or moisture may affect its reliability and lifespan.
