A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, wide traces for power and ground connections.
Follow the recommended power-up sequence: VCC, then VEE, then VIN. Ensure all input and output pins are properly terminated. Configure the device according to the datasheet's recommended settings and application notes.
The device has a maximum junction temperature of 125°C. Ensure good airflow and thermal conduction. Use a heat sink or thermal pad if necessary. Monitor the device's temperature and adjust the design accordingly.
Use an oscilloscope to monitor the input and output signals. Check for proper power-up sequencing, voltage levels, and signal integrity. Consult the datasheet and application notes for troubleshooting guides and FAQs.
Yes, follow proper EMI/EMC design practices: use a shielded enclosure, keep sensitive signals away from noise sources, and use filtering and shielding on input/output lines. Consult the datasheet and application notes for specific guidance.