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    Part Img LTC2376CMS-16#PBF datasheet by Linear Technology

    • LTC2376 - IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO16, LEAD FREE, PLASTIC, MSOP-16, Analog to Digital Converter
    • Original
    • Yes
    • Unknown
    • Transferred
    • 8542.39.00.01
    • 8542.39.00.00
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    LTC2376CMS-16#PBF datasheet preview

    LTC2376CMS-16#PBF Frequently Asked Questions (FAQs)

    • The recommended layout and placement for the LTC2376CMS-16#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to keep the input and output traces short and away from digital signals.
    • To ensure accurate conversion results with the LTC2376CMS-16#PBF, it's essential to follow proper PCB layout and design guidelines, use a high-quality clock source, and ensure that the input signal is properly filtered and conditioned. Additionally, it's recommended to use the device's internal clock or an external clock with a low jitter and to use the device's built-in digital filter to reduce noise and improve accuracy.
    • The maximum sampling rate that can be achieved with the LTC2376CMS-16#PBF is 1.5Msps, and it affects the power consumption by increasing it as the sampling rate increases. The power consumption can be reduced by reducing the sampling rate, using the device's power-down mode, or using an external clock with a lower frequency.
    • The LTC2376CMS-16#PBF has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) circuits that protect the device from input voltages exceeding 6V or falling below 2.7V. However, it's still recommended to use external protection circuits, such as voltage regulators, TVS diodes, and resistors, to ensure that the device operates within its recommended operating conditions.
    • The LTC2376CMS-16#PBF has a maximum junction temperature (TJ) of 150°C, and it's essential to ensure that the device operates within its recommended thermal conditions to maintain its reliability and performance. This can be achieved by using a heat sink, reducing the power consumption, and ensuring good airflow around the device.
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