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    Part Img LPC1759FBD80 datasheet by NXP Semiconductors

    • 32-bit ARM Cortex-M3 MCU; up to 512 kB flash and 64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
    • Original
    • Yes
    • Unknown
    • Active
    • 3A991.A.2
    • 8542.31.00.01
    • 8542.31.00.00
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    LPC1759FBD80 datasheet preview

    LPC1759FBD80 Frequently Asked Questions (FAQs)

    • The maximum operating temperature range for the LPC1759FBD80 is -40°C to +105°C, but this can be extended to -40°C to +125°C for some specific packages and with certain limitations.
    • The clock settings for the LPC1759FBD80 can be configured using the Clock Generation Unit (CGU) and the Power Management Unit (PMU). The CGU generates the clock signals for the CPU, peripherals, and other components, while the PMU controls the power modes and clock frequencies. The configuration is typically done using registers and can be found in the user manual and application notes.
    • The maximum current consumption of the LPC1759FBD80 depends on the operating frequency, voltage, and peripherals used. According to the datasheet, the typical current consumption is around 130 mA at 100 MHz and 3.3V, but this can increase to around 250 mA at 200 MHz and 3.3V. It's recommended to consult the datasheet and application notes for more detailed information.
    • The LPC1759FBD80 has a USB 2.0 full-speed device controller that can be used for communication with a host device. To use the USB interface, you need to configure the USB registers, enable the USB clock, and implement the USB protocol stack. NXP provides a USB stack and example code in their software development kits (SDKs) and application notes.
    • The LPC1759FBD80 has 512 KB of flash memory, but not all of it can be used for code storage. The boot loader and other system functions occupy some of the flash memory, leaving around 450 KB available for user code.
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