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    Part Img LPC1111FHN33/102 datasheet by NXP Semiconductors

    • 32-Bit, ARM Cortex-M0, 32KB Flash, 8 KB SRAM
    • Original
    • Unknown
    • Unknown
    • Active
    • 3A991.A.2
    • 8542.31.00.01
    • 8542.31.00.00
    • Find it at Findchips.com

    LPC1111FHN33/102 datasheet preview

    LPC1111FHN33/102 Frequently Asked Questions (FAQs)

    • The maximum operating temperature range for the LPC1111FHN33/102 is -40°C to +85°C.
    • The clock source for the LPC1111FHN33/102 can be configured using the SYSCON registers. The internal RC oscillator can be used as the clock source, or an external crystal oscillator can be used. The clock source can be selected using the CLKSRC register.
    • The maximum current consumption of the LPC1111FHN33/102 is approximately 13.5 mA at 3.3V and 48 MHz.
    • The LPC1111FHN33/102 can be programmed using a variety of tools, including the NXP LPCXpresso IDE, Keil µVision, and IAR Embedded Workbench. The device can be programmed using the UART, SPI, or I2C interfaces.
    • The boot loader in the LPC1111FHN33/102 is used to load the application code into the device's flash memory. The boot loader can be used to update the firmware in the field, and it provides a secure way to load code into the device.
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