The recommended land pattern for LP0402N5200ANTR is a rectangular pad with a size of 0.5mm x 0.25mm, with a non-solder mask defined (NSMD) pad shape.
Yes, LP0402N5200ANTR is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
Yes, LP0402N5200ANTR is compatible with lead-free soldering processes, with a recommended reflow temperature of 260°C.
The maximum operating temperature for LP0402N5200ANTR is 125°C, with a derating of capacitance and ESR above 85°C.
Yes, LP0402N5200ANTR meets the requirements of the Automotive Electronics Council (AEC) and is suitable for use in automotive applications.